Fully Automated Grinding Equipment for Through-Si Via Wafers (IMAGE)

Japan Science and Technology Agency

Fully Automated Grinding Equipment for Through-Si Via Wafers

Caption

Wafers are transported between stages in the EFEM and cleaning module. In the grinding module, the wafers move from rough grinding to finish grinding as the index table rotates.

Credit

Okamoto Machine Tool Works, Ltd.

Usage Restrictions

None

License

Original content

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