Laser-induced thermocompression bonding for Cu-Au bonding (IMAGE)

International Journal of Extreme Manufacturing

Laser-induced thermocompression bonding for Cu-Au bonding

Caption

By modulating the laser intensity and polarization to enhance scattering, the surface tension-induced contraction of the Cu-Au bonding interface is suppressed.

Credit

By Hui Wan, Yu Shu, Shuo Chen, Hao Cao, Shengjun Zhou, Sheng Liu and Chengqun Gui

Usage Restrictions

Credit must be given to the creator.

License

CC BY

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