Automatic docking between two thin-film electronic devices (IMAGE)
Caption
Kinetic electronics module A, which integrates an electrical circuit and an actuator, deforms in response to an electrical input and connects mechanically and electrically to thin-film circuit module B via the docking mechanism. Before connection (left image), the two modules are separate; after connection (right image), Module A holds and lifts Module B, and by supplying power through the connection point, it can independently drive Module B to deform.
Credit
Fumihiro Sassa/Kyushu University
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Only for media and non-commercial use.
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Original content