Fig. 1 (IMAGE)

The University of Osaka

Fig. 1

Caption

Concept and key features of the photoresponsive adhesive developed in this study. Based on the concept of “interfacial switching,” light irradiation selectively changes the elastic modulus of only the adhesive interface, enabling clean, residue-free debonding while allowing both the substrate and the adhesive to be reused. The technology is expected to contribute to the recycling of electronic devices, automobiles, semiconductor components, and other products.

Credit

Yoshinori Takashima

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