Figure 1. Structural diagram of BBCube 3D (IMAGE)
Caption
The proposed technology uses a stacked design where processing units (xPU) sit atop multiple interconnected memory layers (DRAM). By replacing wires with through-silicon vias (TSVs), the lengths of the connections can be shortened, leading to better overall electrical performance.
Credit
Profesor Takayuki Ohba
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Credit must be given to the creator. Only noncommercial uses of the work are permitted. No derivatives or adaptations of the work are permitted.
License
CC BY-NC-ND