Figure 2. Chip micrograph and the photo of the printed circuit board (PCB) of the proposed TD-MIMO receiver (IMAGE)
Caption
The TD-MIMO receiver is fabricated using a common 65nm CMOS process making it suitable for scalable production. The PCB has four layers and integrates a 1 by 8 antenna array in the bottom layer.
Credit
The 2024 IEEE Symposium on VLSI Technology & Circuits
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CC BY-NC-ND