Manufacturing process and characteristics of the M-PCM ultrathin film (IMAGE)
Caption
Fig. 2. Manufacturing process and characteristics of the M-PCM ultrathin film. (a) Schematic illustration of the fabrication of the M-PCM film. (b) Photograph of the large-scale M-PCM film with a width of 20 cm from a far distance under natural sunlight, showing its matte silver appearance and flexibility. (c) Top-view SEM image of the hexagonally close-packed monolayer 10-µm-diameter SiO2 microspheres. (d) SEM image of the M-PCM film with the indentations of the deciduous microspheres (inset, cross-section view of the M-PCM film), showing the approximately 3/4 embedding depth of the SiO2 microspheres in the PDMS matrix. (e) Photograph of the small-scale M-PCM film under laboratory lighting at close range, exhibiting vivid diffraction color. (f) The measured solar reflectivity and Mid-Infrared (MIR) emissivity of the fabricated M-PCM film, along with the corresponding simulated MIR emissivity. Solid lines represent measurements; the dashed line represents the simulation, which takes into account the uneven embedding depths of microspheres in the experiment. (g) Emissivity and selectivity of this work, in comparison with state-of-the-art results.
Credit
PhotoniX
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