Fig. 3 Interferometric Scattering-based Optical Tomoslicing. (IMAGE)

Light Publishing Center, Changchun Institute of Optics, Fine Mechanics And Physics, CAS

Fig. 3 Interferometric Scattering-based Optical Tomoslicing.

Caption

Fig. 3 Interferometric Scattering-based Optical Tomoslicing. (a) Schematic of line light field production by a cylindrical lens. (b) Planar slicing results showing a kerf width of 824 nm, local and magnified views. (c) Planar wafering with high transmittance using cold split without etching. The wafering size is 30×10 mm. (d-e) Tilted slicing with an inclination angle of ~45°. (f) Demonstration of wavy slicing. The peak-to-valley height difference is 12 μm, the period is 70 μm, and the minimum radius of curvature is approximately 21 μm. (g) 4-layer slicing of pure YAG crystals. The wafer thickness is 8.6 μm and the kerf width is 0.9 μm. (h) Disk-shaped YAG thin plate with a diameter of 500 μm.

Credit

Hongbo Sun et al.

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