Device fabrication and packaging. (IMAGE)

Light Publishing Center, Changchun Institute of Optics, Fine Mechanics And Physics, CAS

Device fabrication and packaging.

Caption

(a) Optical micrograph of the transferring process. (b) Device is packaged in a standard fiber-optic connector.

Credit

by Xiaqing Sun, Zeyu Lei, Hao Zhong, Chenjia He, Sihang Liu, Qingfeng Meng, Qingwei Liu, Shengfu Chen, Xiangyang Kong, and Tian Yang

Usage Restrictions

Credit must be given to the creator.

License

CC BY

Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.