News Release

Ultrafast laser shock straining in chiral chain 2D materials: Mold topology‑controlled anisotropic deformation

Peer-Reviewed Publication

Shanghai Jiao Tong University Journal Center

Ultrafast Laser Shock Straining in Chiral Chain 2D Materials: Mold Topology‑Controlled Anisotropic Deformation

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  • Realized ultrafast laser shock imprinting on chiral chain tellurene: Reveals crystallographic orientation-dependent deformation in 2D tellurium via laser shock imprinting.
  • Dual deformation regimes: Identifies two distinct strain response modes—parallel strain enables chain gliding and rotation, while transverse strain induces multimodal shear-driven deformations, dramatically altering lattice structure and properties.
  • Mold topology enabled strain localization and single-crystal retention—sharp edges generate localized shear, forming dislocations more effectively than smooth molds. Asymmetric strain achieves dense deformation while preserving single-crystal zones, enabling precise optoelectronic nanostructuring.
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Credit: Xingtao Liu, Danilo de Camargo Branco, Licong An, Mingyi Wang, Haoqing Jiang, Ruoxing Wang, Wenzhuo Wu*, Gary J. Cheng*.

As 2D materials race toward flexible electronics, precisely tailoring their strain fields without cracking crystals remains a grand challenge. Now, a Purdue team led by Prof. Gary J. Cheng and Prof. Wenzhuo Wu demonstrates the first laser-shock imprinting (LSI) on chiral-chain tellurene, revealing orientation-dependent deformation that retains single-crystal integrity while generating dense dislocation networks—offering a universal route for nanoscale strain engineering of anisotropic 2D systems.

Why LSI on Tellurene Matters

  • Ultrafast & High-Resolution: 5-ns, 0.4 GW cm-2 pulse delivers smooth 3-D nanoshaping with sub-micron feature control.
  • Orientation-Sensitive Mechanics: Parallel strain drives chain gliding/rotation; transverse strain triggers multimodal shear—tuning bandgap and carrier mobility on demand.
  • Single-Crystal Retention: Severe plastic zones coexist with pristine lattice, enabling functional device integration without loss of crystallinity.

Innovative Design & Features

  • Mold-Topology Control: Sharp-edged gratings produce localized shear > homogeneous CD-mold fields, forming dislocation tangles and 6.37° lattice rotations.
  • Dual Deformation Regimes: MD-validated models show chain sliding (‖) versus chain twisting (⊥) at 460 MPa shear stress—matching HR-TEM observations.
  • Raman Fingerprint: Perpendicular strain red-shifts A₁ mode to 117 cm-1 (tensile); parallel strain blue-shifts to 121.5 cm-1 (compressive), providing non-destructive strain read-out.

Applications & Outlook

  • Strain-Tunable Photodetectors: Anisotropic absorption edges promise CMOS-compatible, bendable IR sensors.
  • Flexible Thermoelectrics: Controlled defect networks scatter phonons while preserving σ, boosting ZT in wearable energy harvesters.
  • Scalable Manufacturing: Roll-to-roll LSI molds compatible with 4-inch wafers; team targets cm2 tellurene TEG arrays delivering >1 mW cm-2.

This work establishes LSI as a precision tool for sculpting 2D chiral semiconductors, bridging ultrafast mechanics with optoelectronic property design. Stay tuned for more advances from Prof. Cheng & Prof. Wu’s labs!


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