image: Presenting the signed MOU (center, from left to right): Mr. Christof Landesberger of Fraunhofer EMFT, Mr. Erik Jung of Fraunhofer IZM, President Hisao Ogawa of Kumamoto University, and President Takeshi Deguchi of Yamagata University.
Credit: Kumamoto University
KUMAMOTO, Japan — In a major strategic move to advance global semiconductor research and talent development, Kumamoto University has officially joined forces with Yamagata University and two institutes of Germany’s prestigious Fraunhofer-Gesellschaft—Fraunhofer IZM and Fraunhofer EMFT.
On September 15, 2026, a high-level signing ceremony was held in Kumamoto City to formalize a comprehensive Memorandum of Understanding (MOU). Facilitated with the vital support of the Japan External Trade Organization (JETRO), the landmark agreement establishes a powerful quad-institutional framework uniting leading academic expertise and world-class applied research from Japan and Germany.
The ceremony brought together key institutional leaders, including Kumamoto University President Hisao Ogawa, Yamagata University President Takeshi Deguchi, Mr. Erik Jung of Fraunhofer IZM, and Mr. Christof Landesberger of Fraunhofer EMFT, alongside representatives from JETRO and the Fraunhofer Representative Office Japan.
Driving Semiconductor Excellence Through Global Synergy
This new international partnership aims to create a dynamic research cluster by combining the unique strengths of all four institutions, focusing heavily on cutting-edge domains such as semiconductor packaging, system integration, and printed electronics.
Under the MOU, the institutions will accelerate collaborative momentum through:
- Global Talent Mobility: Active exchange programs for researchers, administrative staff, and students.
- Joint R&D Initiatives: Co-developed projects tackling next-generation technological hurdles.
- Knowledge Transfer: Seamless sharing of academic insights, educational resources, and industry data.
Bridging Academia, Local Industry, and Medical Applications
The partnership builds directly upon the success of the Japan-Germany Joint Workshop, "Semiconductor Packaging: Toward Integration with Printed Electronics," hosted at Kumamoto University on September 14. Impressed by the robust ecosystem of Kumamoto’s local small and medium-sized enterprises specializing in semiconductor equipment and materials, the German delegation emphasized that the MOU will pave the way for expansive cooperation extending deep into regional industry networks.
Furthermore, highlighting Kumamoto University's interdisciplinary vision, President Ogawa underscored the transformative potential of merging advanced semiconductor technology with the medical sector, pointing toward pioneering applications in smart medical devices such as catheters and advanced electrocardiography.
By spearheading this international alliance, Kumamoto University further strengthens its position in international semiconductor research and education, driving cutting-edge innovation, industry collaboration, and next-generation human resource development.