Photograph of the flip-chip bonded hybrid device (IMAGE)

ETH Zurich Department of Physics

Photograph of the flip-chip bonded hybrid device

Caption

Photograph of the flip-​chip bonded hybrid device, with the acoustical-​resonator chip on top of the superconducting-​qubit chip. The bottom chip is 7 mm in length.

Credit

Adapted from von Lüpke et al. Nat. Phys. DOI: 10.1038/s41567-​022-01591-2 (2022).

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