Empowering polymeric materials discovery with artificial intelligence
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Updates every hour. Last Updated: 21-Oct-2026 03:16 ET (21-Oct-2026 07:16 GMT/UTC)
Seven-transmembrane (7TM) proteins are large, complex molecules with important biological functions, but high-resolution NMR structural data for 7TM proteins has eluded researchers. Recently, a team from Japan achieved high-resolution solid-state NMR (SSNMR) data for fully protonated SzR1, a 7TM protein, in a fully hydrated lipid bilayer utilizing ultrafast magic angle spinning (MAS) NMR at 160 kHz using a 0.4mm rotor.
A new study shows that the Pt/C catalyst state before ionomer addition governs later ink dispersion and electrochemical Pt accessibility.
Researchers at Osaka Metropolitan University have produced the first detailed map of molecular gas across Stephan’s Quintet, a nearby group of interacting galaxies where some regions form stars far less efficiently than expected. Their observations reveal that the effect of turbulence on star-forming gases may control whether stars are birthed or not.
A joint research team from NIMS and the University of Tokyo developed a new composite in which three-dimensional nano-interfaces are distributed throughout the material, by coating the surface of magnetic insulator powders with metal and sintering them. Using this structure, the team succeeded in observing thermoelectric conversion driven by spins in an insulator, a phenomenon previously observed only at nanoscale thin-film interfaces, in a macroscale material. This research result, which provides a new material design paradigm for effectively utilizing thermal energy in insulators, was published in Nature Communications on July 21, 2026.
Researchers led by the University of Osaka developed a reusable light-responsive adhesive that switches adhesion at the interface instead of weakening the whole material. UV-A light reduces interfacial adhesion, enabling selective peeling without observable residue, while UV-C light restores adhesion. The response was retained through repeated cycles without solvent processing. The approach could simplify disassembly, repair, and recycling of electronics, vehicles, and semiconductor components, supporting more circular manufacturing across industries.