Photonic chip packaging for extreme environments
Peer-Reviewed Publication
Updates every hour. Last Updated: 16-Apr-2026 20:16 ET (17-Apr-2026 00:16 GMT/UTC)
Scientists at the National Institute of Standards and Technology (NIST)have just published an article in Photonics Research about a new process for packaging photonic integrated circuits so that they can survive and operate in some of the most extreme environments imaginable.
Here's a link to the press release. https://www.nist.gov/news-events/news/2026/03/nist-researchers-develop-photonic-chip-packaging-can-withstand-extreme
The advance could allow photonic chip-based technologies to operate in deep-space probes, inside nuclear reactors, in ultrahigh vacuum systems, and at temperatures both near absolute zero and in scorchingly hot industrial settings. Although the new packaging process now requires several days to complete, engineers could shorten the time dramatically, making the technique suitable for large-scale manufacturing.
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