A review paper by scientists from Tianjin University presented light on brain-on-a-chip interfaces (BoCIs)—a groundbreaking technology that fuses lab-grown biological neural networks with electronic systems to enable bidirectional information exchange.

To support research that could lead to significant external funding, Binghamton University’s Thomas J. Watson College of Engineering and Applied Science has established a new program offering seed grants to faculty members working in key topic areas.

A major challenge in thermal-management and thermal-insulation technologies, across multiple industries, is the lack of materials that simultaneously offer low thermal conductivity, mechanical robustness, and scalable fabrication routes. An international team of researchers addresses this long-standing problem by demonstrating that ytterbium nitride alloying in aluminum nitride can dramatically reduce its thermal conductivity to near-amorphous levels without disrupting the crystalline structure. This provides a new industry-compatible solution for high-temperature insulation, cryogenic systems, and semiconductor thermal shielding.