A recent review has introduced the concept of scaling laws to urban ecosystems, offering a novel perspective on city growth and ecological balance. By merging thermodynamic principles with urban metabolism, researchers have created a framework that not only predicts shifts in urban ecosystems but also provides insights for more sustainable urban planning. This approach illuminates the delicate balance between urban expansion and ecological sustainability, promising to reshape how we manage cities in an era of rapid growth and environmental change.

【When Excel Meets AI: The Rise of Self-Thinker Spreadsheets!】

A groundbreaking review by Prof. Jing Zhang & Prof. Yueguo Chen exposes how AI is rewriting the rules of table processing—and why your Excel skills might soon be obsolete!

To overcome these limitations, a research team led by Dr. Tae Ann Kim of the Convergence Research Center for Solutions to Electromagnetic Interference in Future-mobility (SEIF) at Korea Institute of Science and Technology (KIST) has developed a new polymeric material with self-healing capabilities and high recyclability.

Researchers at Toyohashi University of Technology, in collaboration with the Indian Institute of Technology Madras and the National Institute of Technology, Gifu College, have developed a novel system to control the movement of Euglena gracilis using laser light and a digital projector. This method enables precise spatiotemporal manipulation of Euglena with negative phototaxis, opening possibilities for biomedical applications such as targeted drug delivery.

Raytheon, an RTX business, committed $2 million to the College of Engineering at the University of Arzona. The company's gift names a student leadership gift within the planned Student Design and Innovaton Center.

This study explores liquid metal-based flexible three-dimensional integrated circuits (3D ICs), highlighting their exceptional conductivity, stretchability, and biocompatibility. By leveraging 3D printing and advanced fabrication methods, researchers achieve high-resolution, scalable circuits for wearable and biomedical applications. The work addresses key challenges such as oxidation, interconnect stability, and multilayer integration, paving the way for next-generation flexible electronics.